solutions
Darbond? 6331U（Flexible Die attach）
Heating rapid curing
High flexibility, low hardness, low modulus, and excellent high-temperature stability
High adhesion, electrolyte resistance, salt spray resistance
Mainly used in power appliances, such as: MEMS die attach and sealing
Darbond? 6214
Heating rapid curing
Low-expansion coefficient
Excellent temperature cycling resistance
Mainly used for bonding of microchips
Darbond? 6215（Low temperature fast curing）
One-component
Fast curing at lower temperature
Excellent bonding property
Mainly used in smart card chip bonding
Darbond? 6210F（Encapsulating compound）
Single component, medium viscosity
Low curing shrinkage, Anaerobic polymerization inhibition phenomenon.
Excellent sealing and bonding protection for most substrates
Mainly used in packaging fields such as smart card, CSP, BGA, etc.